Hardware/EMMC NAND

Differentiation

8GB / Basic models

Samsung KLM8G2FE3B-B001

Partnumber: KLM8G2FE3B-B00x
Density:    8GB
Controller: VFX_U
Package: 153-ball BGA
Package type: 2 chip (DDP)
Package size: 11.5mm x 13mm
MMC version: eMMC4.41
Class: Class100
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Toshiba THGBM4G6D2HBAIR

Partnumber: THGBM4G6D2HBAIR
Density: 8GB
Controller: ?
Package: 153-ball BGA
Package type: ?
Package size: 11.5mm x 13mm
MMC version: eMMC4.41
Class: ?
Organisation: ?
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

32GB Deluxe/Premium models

Samsung KLMBG4GE4A-A001

Partnumber: KLMAG2GE4A-A00x
Density:    32GB
Controller: VHX
Package: 169-ball BGA
Package type: 2 chip (DDP)
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: Class400
Organisation: x8
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Samsung KLMBG4GEND-B031

Partnumber: KLMBG4GEND-B031
Density:    32GB
Controller: ?
Package: 153-ball BGA
Package type: ?
Package size: 11.5mm x 13mm
MMC version: eMMC5.0
Class: ?
Organisation: ?
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Toshiba THGBM4G8D4GBAIE

Partnumber: THGBM4G8D4GBAIE
Density: 32GB
Controller: ?
Package: 169-ball BGA
Package type: ?
Package size: 12mm x 16mm
MMC version: eMMC4.41
Class: -
Organisation: ?
Voltage : 1.7 - 1.95V / 2.7 - 3.6V

Toshiba THGBM9G8T4KBAIR

Partnumber: THGBM9G8T4KBAIR
Density: 32GB
Controller: ?
Package: 153-ball BGA
Package type: ?
Package size: 12mmx13mm
MMC version: eMMC5.0?
Class: ?
Organisation: ?
Voltage: 1.7 - 1.95V / 2.7 - 3.6V

Hynix H26M64002BNR

Partnumber: H26M64002BNR
Density: 32GB
Controller: ?
Package: 169-ball BGA
Package type: ?
Package size: 14mm x 18mm
MMC version: eMMC4.41
Class: ?
Organisation: ?
Voltage : 1.8V / 2.7V to 3.6V

Non WiiU examples

• Xbox-one: SK Hynix H26M42003GMR 8GB eMMC NAND Flash
• Xbox 360 Arcade consoles: Samsung KLM4G1HE3F-B001 (4GB class50 BGA153)
• PS3 CECH-40xx 12GB consoles: Samsung KLMAG2GE4A-A001 (16GB class400 BGA169)
• PSVita: Toshiba THGBM3G5D1FBAIE 4GB eMMC NAND Flash

Pinout

eMMC-BGA169

MMC-plus 13pad layout

MMC, SD, miniSD, microSD cards pinout

eMMC in Wii-U - pinout

eMMC in Wii-U removed (as you can see, only 4-bit mode is used)

BGA169 Pad #	MMC-plus (1-,4-,8-bit) Pad #	MMC (1bit) Pad #	SD (1-,4-bit) Pad #	miniSD (1-,4-bit) Pad #	microSD (1-,4-bit) Pad #	Name	Type	Description
A-G 1-14	-	-	-	-	-	NP or NC	-	not present or not connected
H3	07	07	07	07	07	DATA0	I/O	Data I/O : Bidirectional channel used for data transfer
H4	08	-	08	08	08	DATA1	I/O	Data I/O : Bidirectional channel used for data transfer
H5	09	-	09	09	01	DATA2	I/O	Data I/O : Bidirectional channel used for data transfer
J2	01	01 (NC)	01	01	02	DATA3	I/O	Data I/O : Bidirectional channel used for data transfer
J3	10	-	-	-	-	DATA4	I/O	Data I/O : Bidirectional channel used for data transfer
J4	11	-	-	-	-	DATA5	I/O	Data I/O : Bidirectional channel used for data transfer
J5	12	-	-	-	-	DATA6	I/O	Data I/O : Bidirectional channel used for data transfer
J6	13	-	-	-	-	DATA7	I/O	Data I/O : Bidirectional channel used for data transfer
K2	04	04	04	04	04	VDDi	Supply	Internal power node. Connect 0.1uF capacitor from VDDi to ground.
K4	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
K6	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
M6	04	04	04	04	04	VCC	Supply	Flash I/O and memory power supply
M7	03 / 06	03 / 06	03 / 06	03 / 06	06	VSS	Ground	Flash I/O and memory ground connection
N5	04	04	04	04	04	VCC	Supply	Flash I/O and memory power supply
P5	03 / 06	03 / 06	03 / 06	03 / 06	06	VSS	Ground	Flash I/O and memory ground connection
R10	03 / 06	03 / 06	03 / 06	03 / 06	06	VSS	Ground	Flash I/O and memory ground connection
T10	04	04	04	04	04	VCC	Supply	Flash I/O and memory power supply
U5	-	-	-	-	-	RESET	Input	Hardware Reset (not connected on PS3 and Wii-U)
U8	03 / 06	03 / 06	03 / 06	03 / 06	06	VSS	Ground	Flash I/O and memory ground connection
U9	04	04	04	04	04	VCC	Supply	Flash I/O and memory power supply
W4	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
W5	02	02	02	02	03	CMD	I/O	Command: A bidirectional channel used for device initialisation and command transfers
W6	05	05	05	05	05	CLK	Input	Clock: Each cycle directs a 1-bit transfer on the command and DAT lines
Y2	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
Y4	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
Y5	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
AA3	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
AA4	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
AA5	04	04	04	04	04	VCCQ	Supply	Memory controller core and MMC IF I/O power supply
AA6	03 / 06	03 / 06	03 / 06	03 / 06	06	VSSQ	Ground	Memory controller core and MMC IF ground connection
AB-HG 1-14	-	-	-	-	-	NP or NC	-	not present or not connected

remark: the following Pad #letter's are not used: I, O, Q, S, X, Z, AI, AO, AQ, AS, AX, AZ

Note: for hooking up to SD card reader the following might be needed:

• 50K nominal (10K - 90K range) Ohm pullup between VCC and DAT3/CD for card detect (see also Application Notes 10911)